JPH0313742U - - Google Patents
Info
- Publication number
- JPH0313742U JPH0313742U JP7467289U JP7467289U JPH0313742U JP H0313742 U JPH0313742 U JP H0313742U JP 7467289 U JP7467289 U JP 7467289U JP 7467289 U JP7467289 U JP 7467289U JP H0313742 U JPH0313742 U JP H0313742U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- package
- metallized layer
- marking
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 2
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989074672U JPH08759Y2 (ja) | 1989-06-26 | 1989-06-26 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989074672U JPH08759Y2 (ja) | 1989-06-26 | 1989-06-26 | 半導体素子収納用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0313742U true JPH0313742U (en]) | 1991-02-12 |
JPH08759Y2 JPH08759Y2 (ja) | 1996-01-10 |
Family
ID=31614568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989074672U Expired - Lifetime JPH08759Y2 (ja) | 1989-06-26 | 1989-06-26 | 半導体素子収納用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08759Y2 (en]) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4888884A (en]) * | 1972-02-23 | 1973-11-21 | ||
JPS5935498A (ja) * | 1982-08-23 | 1984-02-27 | 日本電気ホームエレクトロニクス株式会社 | プリント配線体 |
JPS6146739U (ja) * | 1984-08-31 | 1986-03-28 | 富士通株式会社 | 半導体容器 |
-
1989
- 1989-06-26 JP JP1989074672U patent/JPH08759Y2/ja not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4888884A (en]) * | 1972-02-23 | 1973-11-21 | ||
JPS5935498A (ja) * | 1982-08-23 | 1984-02-27 | 日本電気ホームエレクトロニクス株式会社 | プリント配線体 |
JPS6146739U (ja) * | 1984-08-31 | 1986-03-28 | 富士通株式会社 | 半導体容器 |
Also Published As
Publication number | Publication date |
---|---|
JPH08759Y2 (ja) | 1996-01-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |